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Job Description

Intel NEX Cloud Connectivity (NCCG) team delivers best-in-class Ethernet products and is at the heart of Intel's transformation from a PC company to a company that powers the cloud and billions of smart, connected computing-devices. NCCG's compelling Ethernet products move the world's data and are the foundations of cloud service and telecommunications data centers. We are a team of problem solvers, experimenters, and innovators who are dedicated to designing the network technologies that currently lead and continue to transform datacenter ecosystems. As a world-class organization, we're looking for outstanding talent to accelerate our growth during an exciting time in Ethernet networking marketing technology. If you're ready to be a part of this journey, then we want to hear from you.

In this position, you will be responsible for the project management and the delivery of the package design tape-outs and design collateral. You will scope all package design requirements, document them, and ensure compliance to meet the required product specifications and performance. You will be responsible for leading the product design from the planning phase to design tape-out and supporting our stakeholders' post-tape-out as required.

Qualifications

Responsibilities include but not be limited to: - Involving in the Package Design Working Group to work with key internal/external partners to comprehend the detailed design requirements. - Managing the package design schedule partnering with stakeholders to ensure package tape-out per schedule. - Good understanding of the Package/Assembly cost and leveraging design methods to lower the package cost. - Leading the package design reviews to ensure stakeholder approval and design compliance with requirements. - Documenting the detailed design requirements clearly in the PDRD. - Using the CAD software to design the substrate in compliance with existing design rules, electrical requirements, and processes. - Providing routing and fit studies for design tradeoff. - Generating high-quality design documents for manufacturers and package assembly modules. - Continuously improve in the package design work either by coming up with innovations or driving efficiencies that help improve cost, schedule, and quality for the design, ultimately adding value to our company.

Required Skills and Experience - Bachelor/Master degree in Electrical/Electronics or Mechanical Engineering - Experienced in using Package/Board CAD layout software tool such as Cadence, Mentor or any similar software. - Excellent project management skills and the passion to continuously learn. - The applicant should also have good communication (written and presentation) and problem-solving skills. - Excellent teamwork is an expectation. - Additional qualification includes but not limited to: - Experienced in using Electrical Design Analysis software tools such as Ansoft HFSS, Ansoft Q3D, ADS, HSpice, Sigrity, or any equivalent software will be an added advantage. - Good technical knowledge of electrical field theories and electronic fundamentals. Those with sound knowledge in electromagnetic and microwave theory are encouraged to apply.

Inside this Business Group

The Network & Edge Group brings together our network connectivity and edge into a business unit chartered to drive technology end to end product leadership. It's leadership Ethernet, Switch, IPU, Photonics, Network and Edge portfolio is comprised of leadership products critically important to our customers.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.